logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 63378-2-1:2024

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

Standard Details

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 63378-2-1:2024
Document Year: 2024
Pages: 15
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

Currently Viewing

ACTIVE
IEC 63378-2-1:2024
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +