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BS IEC 63378-2-1:2024

Thermal standardization on semiconductor packages - 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

General Information

Status : Definitive
Standard Type: Main
Document No: BS IEC 63378-2-1:2024
Document Year: 2024
Pages: 18
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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Definitive
BS IEC 63378-2-1:2024
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