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BS EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials

General Information

Status : Definitive
Standard Type: Main
Document No: BS EN IEC 61189-2-801:2023
Document Year: 2023
Pages: 16
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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Definitive
BS EN IEC 61189-2-801:2023
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