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BS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA

General Information

Status : Definitive
Standard Type: Main
Document No: BS EN IEC 61189-2-807:2021
Document Year: 2021
Pages: 14
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.180 Printed circuits and boards
  • 35.100.01 Open systems interconnection in general

Life Cycle

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Definitive
BS EN IEC 61189-2-807:2021
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