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BS EN IEC 61189-2-808:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method

General Information

Status : Definitive
Standard Type: Main
Document No: BS EN IEC 61189-2-808:2024
Document Year: 2024
Pages: 26
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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Definitive
BS EN IEC 61189-2-808:2024
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