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IEC

IEC 61189-1:1997 (EN-FR)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Standard Details

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-1:1997 (EN-FR)
Document Year: 1997
Pages: 37
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61189-1:1997 (EN-FR)
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