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PD IEC TR 61760-3-1:2022

Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

General Information

Status : Definitive
Standard Type: Main
Document No: PD IEC TR 61760-3-1:2022
Document Year: 2022
Pages: 30
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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Definitive
PD IEC TR 61760-3-1:2022
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