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IEC TR 61760-5-1:2024

Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components

Standard Details

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC TR 61760-5-1:2024
Document Year: 2024
Pages: 24
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC TR 61760-5-1:2024
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