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IEC 62137-1-4:2009 (EN-FR)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Standard Details

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62137-1-4:2009 (EN-FR)
Document Year: 2009
Pages: 25
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC 62137-1-4:2009 (EN-FR)
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