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IEC 62137-1-1:2007 (EN-FR)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Standard Details

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62137-1-1:2007 (EN-FR)
Document Year: 2007
Pages: 30
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC 62137-1-1:2007 (EN-FR)
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