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Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry
1.1 This test method covers procedures for the analysis of tin-based solder alloys for minor and trace elements using inductively-coupled plasma atomic emission spectrometry (ICP-AES) instrumentation.
1.2 These test procedures were validated for the analytes and mass fractions listed below.
Element | Validated Mass Fraction |
Lead | 115 to 965 |
Cadmium | 25 to 60 |
Mercury | 5 to 530 |
Antimony | 85 to 1330 |
Bismuth | 80 to 210 |
Arsenic | 95 to 360 |
Silver | 4000 to 42100 |
Cobalt | 0.5 to 60 |
Iron | 15 to 115 |
Chromium | 0.5 to 1.5 |
Copper | 3000 to 30600 |
Indium | 25 to 115 |
Nickel | 5 to 150 |
Phosphorus | 10 to 110 |
Selenium | 1 to 30 |
Zinc | 2 to 160 |
Aluminum | 1 to 3 |
1.3 The procedures appear in the following order:
Procedure | Section |
Internal Standardization | 8 |
Calibration Solution Preparations | 9 |
Preparation of Sample and Validation Solutions | 10 |
Calibration | 11 |
Analysis Procedure | 12 |
1.4 The values stated in SI units are to be regarded as the standard. Any other values are for information only.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International StandardDetails, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
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