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ASTM

ASTM F72 : 21

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)

Standard Details

1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished,

General Information

Status : Historical
Standard Type: Main
Document No: ASTM F72 : 21
Document Year: 2021
Pages: 11
  • Section Volume:
  • 10.04 Volume 10.04 Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies
  • ICS:
  • 31.080.01 Semiconductor devices in general

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