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Standard Specification for Electrodeposited Copper for Engineering Uses
1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.
1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.
1.3 This specification is not intended for electrodeposited copper when used for electroforming.
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