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ISO 9455-18 : 2024

Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning

Standard Details

This document specifies test methods for the cleanliness of soldered printed circuit assemblies before and/or after soldering and cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

General Information

Status : Published
Standard Type: Main
Document No: ISO 9455-18 : 2024
Document Year: 2024
Pages: 12
Edition: 1

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ISO 9455-18 : 2024
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