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ISO 9453:2020

Soft solder alloys — Chemical compositions and forms

Standard Details

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

General Information

Status : Published
Standard Type: Main
Document No: ISO 9453:2020
Document Year: 2020
Pages: 13
Edition: 4

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ISO 9453:2020

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