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ISO 9453:2014

Soft solder alloys — Chemical compositions and forms

Standard Details

ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: ISO 9453:2014
Document Year: 2014
Pages: 16
Edition: 3

Life Cycle

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WITHDRAWN
ISO 9453:2014

WITHDRAWN
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