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ISO 9453:2006

Soft solder alloys — Chemical compositions and forms

Standard Details

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: ISO 9453:2006
Document Year: 2006
Pages: 10
Edition: 2

Life Cycle

WITHDRAWN

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ISO 9453:2006
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