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IEC 62258-6:2006

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Standard Details

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62258-6:2006
Document Year: 2006
Pages: 9
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices

Life Cycle

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ACTIVE
IEC 62258-6:2006
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