logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC TR 63357:2022

Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles

Standard Details

IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC TR 63357:2022
Document Year: 2022
Pages: 14
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices

Life Cycle

Currently Viewing

ACTIVE
IEC TR 63357:2022
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +