IEC 62047-26:2016 (EN-FR)

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

Standard Details

IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.

General Information

Status : ACTIVE

Standard Type: Main

Document No: IEC 62047-26:2016 (EN-FR)

Document Year: 2016

Pages: 57

Edition: 1.0

Section Volume:
TC 47.SC 47F Micro-electromechanical systems

ICS:
31.080.99 Other semiconductor devices

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IEC 62047-26:2016 (EN-FR)

IEC 62047-26:2016 (EN-FR)

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