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IEC 62047-25:2016 (EN-FR)

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

Standard Details

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62047-25:2016 (EN-FR)
Document Year: 2016
Pages: 45
Edition: 1.0

Life Cycle

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IEC 62047-25:2016 (EN-FR)
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