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IEC 62047-18:2013 (EN-FR)

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Standard Details

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62047-18:2013 (EN-FR)
Document Year: 2013
Pages: 26
Edition: 1.0

Life Cycle

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ACTIVE
IEC 62047-18:2013 (EN-FR)
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