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IEC 62047-16:2015 (EN-FR)

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

Standard Details

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62047-16:2015 (EN-FR)
Document Year: 2015
Pages: 21
Edition: 1.0

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IEC 62047-16:2015 (EN-FR)
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