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BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

General Information

Status : Definitive
Standard Type: Main
Document No: BS IEC 62047-27:2017
Document Year: 2017
Pages: 20
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)

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Definitive
BS IEC 62047-27:2017
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