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IEC 60749-9:2002

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Standard Details

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.The contents of the corrigendum of August 2003 have been included in this copy.

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: IEC 60749-9:2002
Document Year: 2002
Pages: 9
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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WITHDRAWN
IEC 60749-9:2002
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