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IEC 60749-35:2006 (EN-FR)

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Standard Details

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-35:2006 (EN-FR)
Document Year: 2006
Pages: 43
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60749-35:2006 (EN-FR)
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