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IEC 60749-25:2003 (EN-FR)

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Standard Details

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-25:2003 (EN-FR)
Document Year: 2003
Pages: 25
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60749-25:2003 (EN-FR)
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