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IEC 60749-19:2003 (EN-FR)

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Standard Details

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-19:2003 (EN-FR)
Document Year: 2003
Pages: 11
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60749-19:2003 (EN-FR)
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