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IEC 60749-16:2003 (EN-FR)

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Standard Details

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-16:2003 (EN-FR)
Document Year: 2003
Pages: 13
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60749-16:2003 (EN-FR)
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