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IEC 60749-14:2003 (EN-FR)

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Standard Details

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-14:2003 (EN-FR)
Document Year: 2003
Pages: 27
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60749-14:2003 (EN-FR)
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