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IEC 62899-202-9:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

Standard Details

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62899-202-9:2023
Document Year: 2023
Pages: 14
Edition: 1.0
  • Section Volume:
  • TC 119 Printed Electronics
  • ICS:
  • 31.180 Printed circuits and boards
  • 87.080 Inks. Printing inks

Life Cycle

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ACTIVE
IEC 62899-202-9:2023
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