logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 61188-5-6:2003 (EN-FR)

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Standard Details

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61188-5-6:2003 (EN-FR)
Document Year: 2003
Pages: 37
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

Currently Viewing

ACTIVE
IEC 61188-5-6:2003 (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +