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IEC TR 60286-7:2019 (EN-FR)

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Standard Details

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC TR 60286-7:2019 (EN-FR)
Document Year: 2019
Pages: 24
Edition: 1.0
  • Section Volume:
  • TC 40 Capacitors and resistors for electronic equipment
  • ICS:
  • 31.020 Electronic components in general
  • 31.240 Mechanical structures for electronic equipment

Life Cycle

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ACTIVE
IEC TR 60286-7:2019 (EN-FR)
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