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BS 5909:1980

Method for scale adhesion test for oxygen-free copper

Standard Details

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

General Information

Status : Under Review
Standard Type: Main
Document No: BS 5909:1980
Document Year: 1980
Pages: 6
  • Section Volume:
  • GBM15 Metal Treatment & Welding (GMB15)
  • GBM40 Metallurgy (GMB40)
  • ICS:
  • 77.040.99 Other methods of testing of metals

Life Cycle

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Under Review
BS 5909:1980
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