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BS 3934-5:1992

Mechanical standardization of semiconductor devices - Recommendations for tape automated bonding (TAB) of integrated circuits

Standard Details

Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or 'chip carriers'.

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: BS 3934-5:1992
Document Year: 1992
Pages: 16
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.080.01 Semiconductor devices in general

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BS 3934-5:1992
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