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BS 3934-5:1997

Mechanical standardization of semiconductor devices - Recommendations applying to tape automated bonding (TAB) of integrated circuits

Standard Details

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

General Information

Status : Definitive
Standard Type: Main
Document No: BS 3934-5:1997
Document Year: 1997
Pages: 38
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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Definitive
BS 3934-5:1997
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