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IEC 60191-6-5:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Standard Details

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-5:2001
Document Year: 2001
Pages: 10
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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IEC 60191-6-5:2001
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