IEC 60191-6-12:2011 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Standard Details

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.

General Information

Status : ACTIVE

Standard Type: Main

Document No: IEC 60191-6-12:2011 (EN-FR)

Document Year: 2011

Pages: 37

Edition: 2.0

Section Volume:
TC 47.SC 47D Semiconductor devices packaging

ICS:
31.080.01 Semiconductor devices in general

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IEC 60191-6-12:2011 (EN-FR)

IEC 60191-6-12:2011 (EN-FR)

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