logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 60191-4:2013+AMD1:2018 CSV (EN-FR)

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Standard Details

IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-4:2013+AMD1:2018 CSV (EN-FR)
Document Year: 2018
Pages: 152
Edition: 3.1
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

Currently Viewing

ACTIVE
IEC 60191-4:2013+AMD1:2018 CSV (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +