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IEC

IEC 61249-3-5:1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Standard Details

Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61249-3-5:1999
Document Year: 1999
Pages: 12
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61249-3-5:1999
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