ISO/TS 10303-1650:2018

Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die

Standard Details

ISO/TS 10303-1650:2018-11 specifies the application module for Bare die.

The following is within the scope of ISO/TS 10303-1650:2018-11:

The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.

definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.