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IEC 63055 : 2023

Format for LSI-Package-Board Interoperable design

Standard Details

IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 63055 : 2023
Document Year: 2023
Pages: 292
Edition: 2.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards
  • 31.200 Integrated circuits. Microelectronics
  • 35.060 Languages used in information technology

Life Cycle

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ACTIVE
IEC 63055 : 2023
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