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ISO 4825-1:2023

Fine ceramics (advanced ceramics, advanced technical ceramics) --Test method for thermal property measurements of metalized ceramic substrates — Part 1: Evaluation of thermal resistance for use in power modules

Standard Details

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.

General Information

Status : Published
Standard Type: Main
Document No: ISO 4825-1:2023
Document Year: 2023
Pages: 12
Edition: 1

Life Cycle

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ISO 4825-1:2023
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