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IEC TR 60068-3-12:2014

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

Standard Details

IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition:
- the content has been adapted to the state-of-the-art of reflow-oven technology and termination finishes;
- minor language adjustments were performed.

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: IEC TR 60068-3-12:2014
Document Year: 2014
Pages: 35
Edition: 2.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 19.040 Environmental testing

Life Cycle

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IEC TR 60068-3-12:2014
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