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IEC TR 60068-3-12:2007

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

Standard Details

Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: IEC TR 60068-3-12:2007
Document Year: 2007
Pages: 16
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 19.040 Environmental testing

Life Cycle

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WITHDRAWN
IEC TR 60068-3-12:2007
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