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IEC TR 62866:2014 (EN-FR)

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

Standard Details

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC TR 62866:2014 (EN-FR)
Document Year: 2014
Pages: 187
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC TR 62866:2014 (EN-FR)
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