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IEC 62878-2-603:2025

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Standard Details

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62878-2-603:2025
Document Year: 2025
Pages: 25
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC 62878-2-603:2025
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