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IEC 61188-6-2:2021 (EN-FR)

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Standard Details

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61188-6-2:2021 (EN-FR)
Document Year: 2021
Pages: 49
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC 61188-6-2:2021 (EN-FR)
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