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25/30510059 DC

BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

General Information

Status : Definitive
Standard Type: Main
Document No: 25/30510059 DC
Document Year: 7
Pages: 29
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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Definitive
25/30510059 DC
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