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BS EN 61190-1-2:2007

Attachment materials for electronic assembly - Requirements for soldering pastes for high-quality interconnects in electronics assembly

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: BS EN 61190-1-2:2007
Document Year: 2007
Pages: 22
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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WITHDRAWN
BS EN 61190-1-2:2007
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